发明名称 |
Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure |
摘要 |
A mounting structure for at least one LED has a substrate made of silicon and/or another semiconductor, wherein at least one mounting portion formed in a front surface of the substrate for mounting at least one LED chip thereon, and cooling grooves or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface thereof. |
申请公布号 |
US2011260181(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US20080671700 |
申请日期 |
2008.07.21 |
申请人 |
PERKINELMER ELCOS GMBH |
发明人 |
KOBILKE SIEGMUND;GINDELE FRANK |
分类号 |
H01L33/64;H01L33/48 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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