发明名称 Mounting structure for LEDs, LED assembly, LED assembly socket, method for forming a mounting structure
摘要 A mounting structure for at least one LED has a substrate made of silicon and/or another semiconductor, wherein at least one mounting portion formed in a front surface of the substrate for mounting at least one LED chip thereon, and cooling grooves or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface thereof.
申请公布号 US2011260181(A1) 申请公布日期 2011.10.27
申请号 US20080671700 申请日期 2008.07.21
申请人 PERKINELMER ELCOS GMBH 发明人 KOBILKE SIEGMUND;GINDELE FRANK
分类号 H01L33/64;H01L33/48 主分类号 H01L33/64
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