发明名称 BINDER COMPOSITION FOR MANUFACTURING MOLD
摘要 PROBLEM TO BE SOLVED: To provide a binder composition for manufacturing a mold which can prevent the strength degradation of a mold under high-humidity environment and also can restrain the generation of irritant gas during casting, and to provide a composition for the mold using the binder composition.SOLUTION: The binder composition for manufacturing the mold contains fran resin, and a metallic compound including one or more of metallic elements selected from the groups 2, 4, 7, 10, 11 and 13 of the periodic table. The content of the metallic elements in the binder composition is 0.01-0.70 wt.%. The binder composition comprises one or more of metallic compounds selected from hydroxides, nitrates, oxides, organic acid salts, alkoxides, and ketone complexes.
申请公布号 JP2011212746(A) 申请公布日期 2011.10.27
申请号 JP20110055440 申请日期 2011.03.14
申请人 KAO CORP 发明人 YOSHIDA AKIRA;MATSUO TOSHIKI
分类号 B22C1/22;B22C1/00;B22C1/10 主分类号 B22C1/22
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