| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing film having a preferable expanding property, favorable thickness accuracy, and an excellent pickup property of a semiconductor member after being diced.SOLUTION: A dicing film has a base material layer and an adhesive layer. The base material layer contains random polypropylene (A) and an olefin-system elastomer (B). The random polypropylene contains a butene component of 1-5 wt.%. |
