| 摘要 |
PROBLEM TO BE SOLVED: To provide a new epoxy resin used in an epoxy resin composition, which is suitable for applications such as semiconductor sealing materials, molding materials, laminates, adhesives, and coatings.SOLUTION: The new epoxy resin is represented by general formula (wherein, R is 4-6C hydrocarbon; and n represents a repeating unit of 0-5). |
