发明名称 MOLD FOR MOLDING METALLIC RESIN
摘要 PROBLEM TO BE SOLVED: To suppress occurrence of a fault in a design surface in injection molding using a metallic resin.SOLUTION: A cavity 1 has a design molding surface 11 and a non-design molding surface 12 facing the design molding surface 11. A gate 2 has a first gate inner circumference surface 13 which is connected/installed in a flat state along the non-design molding surface 12 and a second gate inner circumference surface 14 facing the first gate inner circumference surface 13. A runner 3 has a first runner inner circumference surface 15 which is connected/installed in a flat state along the first gate inner circumference surface 13 and a second runner inner circumference surface 16 facing the first runner inner circumference surface 15. A separating distance B between the first gate inner circumference surface 13 and the second gate inner circumference surface 14 is shorter than a separating distance (A) between the design molding surface 11 and the non-design molding surface 12, and a separating distance C between the first runner inner circumference surface 15 and the second runner inner circumference surface 16 is longer than the separating distance B.
申请公布号 JP2011213031(A) 申请公布日期 2011.10.27
申请号 JP20100084889 申请日期 2010.04.01
申请人 SEIKO EPSON CORP 发明人 SHIOBARA KEIICHI
分类号 B29C45/27;B29K103/06 主分类号 B29C45/27
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