| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding structure, a bonding tool, and a wire bonding method enabling miniaturization of a semiconductor module and the like.SOLUTION: The wire bonding structure B includes a wire 6 having a first bonding section 6A bonded to an electrode pad 81 and a second bonding section 6B bonded to a pad section 71B, wherein the first bonding section 6A has a front junction 61 located closer to the second bonding section 6B, a rear junction 63 located separated from the second bonding section 6B, and an intermediate section 62 interposed between the front junction 61 and the rear junction 63 and having a bonding level to the electrode pad 81 lower than any one of the front junction 61 and the rear junction 63, and the second bonding section 6B has a bonding length in a longitudinal direction of the wire 6 shorter than that of the first bonding section 6A. |
