ADHESIVE COMPOSITION, ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To impart a gettering function to a semiconductor device obtained, without performing special treatment to a semiconductor wafer and chip.SOLUTION: An adhesive composition including an acrylic polymer (A), an epoxy thermosetting resin (B), a thermo-curing agent (C), and an organic chelating agent (D) is used as an adhesive that is used for affixing a semiconductor chip to a chip mounting substrate.