| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board with a solder bump reducing a measured value of coplanarity of the solder bump by improving a surface state of the solder bump.SOLUTION: The wiring board is manufactured by performing the substrate preparing step, the ball mounting step, the reflow step, the flux supplying step and the surface state improving step. In the substrate preparing step, a substrate 11 with a pad 21 disposed on its principal surface 12 is prepared. In the ball mounting step, a solder ball is mounted onto the pad 21. In the reflow step, the solder ball is melted with heat to form the solder bumps 62, 63. In the flux supplying step, a flux F2 is supplied onto surfaces of the solder bumps 62, 63. In the surface state improving step, the flux-supplied solder bumps 62, 63 are heated to improve the surface states of the solder bumps 62, 63. |
