| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide and a polyimide solution which are suitably utilized for a part for which dimensional stability, adhesion, heat resistance, low-temperature curability are especially needed as a material which composes a semiconductor device, an electronic circuit board, or the like.SOLUTION: The polyimide comprises a repeating unit expressed by formula (1). In the formula, Rdenotes a tetravalent 6-40C aromatic ring or aromatic heterocyclic group, Rdenotes a divalent aromatic ring group having a benzoxazole structure or a divalent organic group having a siloxane structure. |
