发明名称 |
Power switch component having improved temperature distribution |
摘要 |
A power switch component having a semiconductor switch and a contacting applied to a contact zone of the semiconductor switch is introduced. The contact zone has a semiconductor layer and a metal plating applied to the semiconductor layer. The semiconductor layer has at least one conducting region and at least one non-conducting region situated directly under the metal plating.
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申请公布号 |
US2011260341(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113025344 |
申请日期 |
2011.02.11 |
申请人 |
JACKE THOMAS;FOERSTER CHRISTIAN;HOEHR TIMM;HEINISCH HOLGER;PLUNTKE CHRISTIAN;JOOS JOACHIM |
发明人 |
JACKE THOMAS;FOERSTER CHRISTIAN;HOEHR TIMM;HEINISCH HOLGER;PLUNTKE CHRISTIAN;JOOS JOACHIM |
分类号 |
H01L23/49 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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