SOLDERING METHOD, METHOD FOR MANUFACTURING MOUNTING SUBSTRATE AND SOLDERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a soldering method capable of properly melting solder for connecting an electronic component to a substrate.SOLUTION: Solder balls 101 of a BGA 100 and lands 103 imparted with solder on the substrate 107 are irradiated with a laser beam via a mirror unit 351 between them in a state that the solder balls 101 and the lands 103 are separated. The solder is melted by laser irradiation, then, the mirror unit 351 is pulled out and the BGA 100 is lowered to a position of the substrate 107 by a suction nozzle 353 to solder the BGA 100 to the substrate 107.