ONE PART EPOXY RESIN INCLUDING A LOW PROFILE ADDITIVE
摘要
An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.
申请公布号
WO2011133317(A2)
申请公布日期
2011.10.27
申请号
WO2011US31165
申请日期
2011.04.05
申请人
TRILLION SCIENCE,INC.;LIANG, RONG-CHANG;SUN, YUHAO;SONG, HUA;TSENG, CHIN-JEN;CHUANG, HSIAO, KEN
发明人
LIANG, RONG-CHANG;SUN, YUHAO;SONG, HUA;TSENG, CHIN-JEN;CHUANG, HSIAO, KEN