发明名称 Cutting brittle flat material comprising areas of metal layers on its surface, comprises partially covering flat material surface along dividing line by metal layer areas, exposing to laser radiation and introducing laser radiation energy
摘要 <p>Cutting brittle flat material comprising areas of metal layers on its surface, comprises: at least partially covering the surface of flat material along a dividing line by areas of metal layers; exposing to the laser radiation; introducing the laser radiation energy into the flat material; and reducing the degree of reflection in the areas of the metal layers, which are located along the dividing line before introducing the laser radiation energy.</p>
申请公布号 DE102010018051(A1) 申请公布日期 2011.10.27
申请号 DE20101018051 申请日期 2010.04.22
申请人 JENOPTIK AUTOMATISIERUNGSTECHNIK GMBH 发明人
分类号 B23K26/40;B23K26/42;H01L21/301;H01L31/18 主分类号 B23K26/40
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