| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for wafer processing that can prevent increase of warpage amount, which becomes remarkable when the processing thickness of a wafer is thinned to 50 μm or less, and prevent generation of conveyance errors and suction errors in a processing machine caused by the increase of warpage amount, and that is preferable as a surface protection tape for wafer processing capable of preventing dropout of a processed wafer from a conveyance arm.SOLUTION: In an adhesive tape for wafer processing, a base material film includes a polyester-system resin or a polypropylene resin. The roughness Rmax of a surface opposed to a surface on which an adhesive agent layer is laminated is 0.5-5 μm. |
