发明名称 |
Method For Making A Laminated Chip And Method For Aligning a Lithographic Mask |
摘要 |
A method for making a laminated chip includes: (a) forming a first conductive layer on a substrate; (b) forming an insulating layer on the first conductive layer opposite to the substrate; (c) bombarding the insulating layer using an electron beam to form a plurality of holes that expose the first conductive layer; and (d) forming a second conductive layer on the insulating layer such that a part of the second conductive layer extends into the holes to electrically connect to the first conductive layer.
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申请公布号 |
US2011263122(A1) |
申请公布日期 |
2011.10.27 |
申请号 |
US201113092766 |
申请日期 |
2011.04.22 |
申请人 |
MAX ECHO TECHNOLOGY CORPORATION |
发明人 |
HUANG CHI-CHI |
分类号 |
H01L21/60;G03F1/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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