发明名称 Method For Making A Laminated Chip And Method For Aligning a Lithographic Mask
摘要 A method for making a laminated chip includes: (a) forming a first conductive layer on a substrate; (b) forming an insulating layer on the first conductive layer opposite to the substrate; (c) bombarding the insulating layer using an electron beam to form a plurality of holes that expose the first conductive layer; and (d) forming a second conductive layer on the insulating layer such that a part of the second conductive layer extends into the holes to electrically connect to the first conductive layer.
申请公布号 US2011263122(A1) 申请公布日期 2011.10.27
申请号 US201113092766 申请日期 2011.04.22
申请人 MAX ECHO TECHNOLOGY CORPORATION 发明人 HUANG CHI-CHI
分类号 H01L21/60;G03F1/00 主分类号 H01L21/60
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