| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition for a semiconductor package, which can prevent a trouble caused by warpage or the like when molded integratedly with a metal, and to provide a package for semiconductor molded with the same and a semiconductor member produced by the same.SOLUTION: The curable resin composition is for molding a semiconductor package integrally molded with a metal. The shrinkage by curing is at most 0.5% and the hardness after curing is at least HDD80. |
