| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin wiring board to be mounted with a semiconductor element, the method being capable of forming a via hole for building up directly on a through hole formed in an insulating plate for a core, wherein the wiring board has high-density fine wiring with its width and interval being 20 μm or less in a wiring conductor for the core and uses the insulating plate for the core with a thickness of 140 μm or less.SOLUTION: Only an inner wall of the through hole 7 in the insulating plate 1 for the core having the through hole 7 is deposited with a first plating conductor layer 13 so as to have a perforation coaxial with the through hole 7, an internal of the perforation and top and bottom surfaces of the insulating plate 1 are deposited with a second plating conductor layer 14 filling the perforation and forming the wiring conductor 4 on the top and bottom surfaces of the insulating plate 1 for the core. |
