发明名称 SHEET FOR FORMING RESIN FILM FOR CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
摘要 PROBLEM TO BE SOLVED: To impart a gettering function to a semiconductor device that is available with no special processing applied to a semiconductor wafer and a chip.SOLUTION: A sheet for forming a resin film for a chip includes a peeling sheet and a resin film formation layer which is formed on a peeling surface of the peeling sheet. The resin film formation layer contains a binder polymer component (A), a curing component (B), and a gettering agent (C).
申请公布号 JP2011216677(A) 申请公布日期 2011.10.27
申请号 JP20100083690 申请日期 2010.03.31
申请人 LINTEC CORP 发明人 SHINODA TOMONORI;WAKAYAMA YOJI
分类号 H01L21/683;C09J7/02;C09J11/04;C09J11/06;C09J11/08;C09J201/00;H01L21/301;H01L21/304 主分类号 H01L21/683
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