发明名称 |
SHEET FOR FORMING RESIN FILM FOR CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP |
摘要 |
PROBLEM TO BE SOLVED: To impart a gettering function to a semiconductor device that is available with no special processing applied to a semiconductor wafer and a chip.SOLUTION: A sheet for forming a resin film for a chip includes a peeling sheet and a resin film formation layer which is formed on a peeling surface of the peeling sheet. The resin film formation layer contains a binder polymer component (A), a curing component (B), and a gettering agent (C). |
申请公布号 |
JP2011216677(A) |
申请公布日期 |
2011.10.27 |
申请号 |
JP20100083690 |
申请日期 |
2010.03.31 |
申请人 |
LINTEC CORP |
发明人 |
SHINODA TOMONORI;WAKAYAMA YOJI |
分类号 |
H01L21/683;C09J7/02;C09J11/04;C09J11/06;C09J11/08;C09J201/00;H01L21/301;H01L21/304 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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