ADHESIVE COMPOSITION, ADHESIVE SHEET, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To apply a gettering function to a semiconductor device obtained without applying special processing to a semiconductor wafer and chip.SOLUTION: The adhesive composition is used, which contains acrylic polymer (A), epoxy-based thermosetting resin (B), heavy metal deactivator (C) and curing agent (D) as an adhesive used for fixing the semiconductor chip to a chip loading substrate.