| 摘要 |
A substrate cleaning apparatus includes a cleaning plate, a vibration unit for vibrating the cleaning plate, a suction unit having an intake opening in the vicinity of a tip end portion of the cleaning plate, for sucking an upper surface of a substrate to be cleaned without being in contact with the substrate, and a moving mechanism for moving the cleaning plate relative to the substrate. In the substrate cleaning apparatus, the tip end portion of the cleaning plate is pressed against the upper surface of the substrate to cause the cleaning plate to be elastically deformed, and the cleaning plate moves relative to the substrate in the cleaning direction of the substrate, with the tip end portion of the cleaning plate being in line contact or surface contact with the upper surface of the substrate. Such a configuration allows the substrate to be cleaned stably while preventing scratching the substrate. |
