EPOXY RESIN PRECURSOR COMPOSITION, PREPREG, LAMINATED BOARD, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin precursor composition which suppresses warpage of a semiconductor package, and can meet further thickness reduction of a printed wiring board.SOLUTION: This epoxy resin precursor composition includes: a mixture of epoxy compounds represented by formula (1) (wherein R1s are each independently a 1-4C hydrocarbon group, R2s are each independently hydrogen or a 1-4C hydrocarbon group, and n's are each independently an integer of 0-6); an aromatic diamine curing agent; an inorganic filler; and a basic organic solvent, wherein the inorganic filler comprises silica nanoparticles of an average particle size of 10-150 nm, or a silicone rubber particle of an average particle size of 1-10 μm.