| 摘要 |
In an embodiment, a die package may be provided. The die package may include at least one first height adjusting structure, the at least one first height adjusting structure may include a first adjusting height relative to a common plane; at least one second height adjusting structure may be positioned adjacent to the at least one first height adjusting structure, the at least one second height adjusting structure may include a second adjusting height relative to the common plane; wherein the second adjusting height may be different from the first adjusting height relative to the common plane; a first die may be positioned on the at least one first height adjusting structure; and a mold housing substantially surrounding the at least one first height adjusting structure, the at least one second height adjusting structure and the first die.
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