The present invention relates to a MEMS microphone package which prevents a leakage of sound from a MEMS microphone package using a curing manner. The package of the present invention comprises: a metal case which has a rectangular shape including an open side into which components are inserted and in which an edge of an end of the open side is chamfered to enable easy curing; a PCB on which a MEMS microphone chip and an application specific integrated circuit (ASIC) are mounted and which is inserted into the metal case; and a supporting member which supports the PCB in a curing process and is coated with a resin to seal a space formed between the metal case and the PCB. Here, the resin is formed with silicon or rubber.
