发明名称 INTERCONNECT STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
摘要 In a semiconductor integrated circuit chip including an interconnect layer in which there is a limitation on the lengths of interconnects or areas occupied by the interconnects, empty spaces between power supply interconnect segments having the same potential located in parallel to a priority interconnect direction, are shifted relative to each other within the limits of the lengths and areas of power supply interconnects. As a result, a local increase in resistance is dispersed, whereby an influence on a voltage drop is reduced.
申请公布号 US2011260333(A1) 申请公布日期 2011.10.27
申请号 US201113169398 申请日期 2011.06.27
申请人 PANASONIC CORPORATION 发明人 MATSUMURA YOICHI;KABUO CHIE;OHASHI TAKAKO;KADOTA TADAFUMI;FUJIMOTO KAZUHIKO;MIYASHITA HIROFUMI
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
主权项
地址