| 摘要 |
<p>A microtechnology proven for transferring at least one layer comprising steps in which: a first substrate 20 is prepared comprising a porous layer 11 buried under a useful surface at a non-zero distance; a weakened region 13 is formed by ion implantation between this porous layer and this useful surface; the first substrate is bonded to a supporting substrate 30; a mechanical stress is applied to cause separation at the porous layer so as to obtain, on the one hand, a remnant of the first substrate and, on the other hand, a separated layer rigidly connected to the supporting substrate and comprising a bared surface; processing steps are carried out on the bared surface of the separated layer; the separated layer is bonded, by way of the surface to which the processing steps were applied, to a second supporting substrate ; and a heat treatment is applied to cause separation at the weakened region so as to obtain, on the one hand, a remnant of the separated layer which is rigidly connected to the second supporting substrate and, on the other hand, a remnant of this separated layer which is rigidly connected to the first supporting substrate.</p> |
