发明名称 RADIATION CURABLE RESIN COMPOSITION FOR WIRE COATING
摘要 A resin composition for wire coatings that has excellent adhesion with the center conductor as well as having excellent manufacturing efficiency for the coating layer and sufficient strength is described and claimed. This radiation curable resin composition for wire coating comprises the following ingredients (A), (B) and (D): (A) a urethane(meth)acrylate having two or more structural parts derived from an aliphatic polyol (B) a compound having a cyclic structure and one ethylenically unsaturated group, (D) a compound given by the following Formula (4a), wherein, R8 is a monovalent organic group having an ethylenically unsaturated group, and R9 is a hydrogen atom or a monovalent organic group that may have an ethylenically unsaturated group.
申请公布号 KR20110117723(A) 申请公布日期 2011.10.27
申请号 KR20117021933 申请日期 2010.03.30
申请人 DSM IP ASSETS B.V.;JSR CORPORATION 发明人 YAMAGUCHI HIROSHI;KAMO SATOSHI;KUROSAWA TAKAHIKO
分类号 C09D175/16;C08F290/06;C08G18/48;H01B3/30 主分类号 C09D175/16
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