| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting device for mounting electronic components in the plurality of sides of a substrate by improving operability. <P>SOLUTION: This mounting device is provided with a loader 1 in which substrates are stored; a plurality of bonders 2 to 4 to which those substrates extracted from the loader section are supplied one by one for simultaneously carrying out in parallel the bonding of conductive members 25 to the plurality of sides of each substrate; and a plurality of temporal press-fitting sections 5 to 7 to which each substrate, to which the plurality of conductive members are bonded by the plurality of bonders, is supplied for simultaneously carrying out in parallel the temporal press-fitting of electronic components 26 to the sides of the substrate to which the conductive members are bonded. Furthermore, this mounting device is provided with a plurality of main press-fitting sections 11 to 13 to which each substrate, on which a plurality of electronic components are temporarily press-fit by a plurality of temporal press-fitting sections, is supplied for simultaneously carrying out in parallel the actual press-fitting of the electronic components temporarily press-fit to those substrates; and an unloader 14 in which the plurality of substrates are stored to which the electronic components are actually press-fit by the plurality of actual press-fitting sections. <P>COPYRIGHT: (C)2007,JPO&INPIT |
