发明名称 |
FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT |
摘要 |
<p>An integrated circuit (IC) product includes a redistribution layer (RDL) having at least one conductive layer configured to distribute electrical information from one location to another location in the IC. The RDL also includes a plurality of wire bond pads and a plurality of solder pads. The plurality of solder pads each includes a solder wettable material that is in direct electrical communication with the RDL.</p> |
申请公布号 |
EP2380194(A1) |
申请公布日期 |
2011.10.26 |
申请号 |
EP20090832791 |
申请日期 |
2009.12.18 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
MARTINEZ, LIANE;TOPACIO, RODEN, R.;LOW, YIP, SENG |
分类号 |
H01L23/485;H01L21/48;H01L21/60;H01L23/498;H01L25/065 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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