发明名称 FILM REMOVAL METHOD, PHOTOELECTRIC CONVERSION DEVICE FABRICATION METHOD, PHOTOELECTRIC CONVERSION DEVICE, AND FILM REMOVAL DEVICE
摘要 A film formed on a substrate is radiated with a first light beam to separate the film into a plurality of regions. Repairing is carried out by removing the film at a removal deficient site where the film remains between the plurality of regions. A film removal method allowing separation of a film into a plurality of regions at high yield, a method for fabricating a photoelectric conversion device using the film removal method, and a film removal device can be provided.
申请公布号 US2011259417(A1) 申请公布日期 2011.10.27
申请号 US200913140949 申请日期 2009.12.18
申请人 TOYOKAWA MASAHIRO;TACHIBANA SHINSUKE 发明人 TOYOKAWA MASAHIRO;TACHIBANA SHINSUKE
分类号 H01L31/0216;B29C59/16;H01L31/18 主分类号 H01L31/0216
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