METHOD FOR MANUFACTURING SOLDER COLUMN, APPARATUS FOR MANUFACTURING SOLDER COLUMN, AND SOLDER COLUMN

摘要

Solder wires are conveyed from insert openings for allowing the solder wires to be inserted toward discharge openings from which the solder wires are discharged and the solder wires project. The projecting wires are cut with first cutting blades and the solder wires inserted into the insert openings are cut with second cutting blades. This enables fixed cutting stress on a portion of the solder wires to be cut with the first cutting blades and a portion of the solder wires to be cut with the second cutting blades at the same time to prevent deformation of the cut surface of the cut solder wires. Solder columns having a column shape and having a uniform length along a conveying direction thereof can be manufactured.