发明名称 |
Light emitting diode package structure |
摘要 |
The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.
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申请公布号 |
US8044420(B2) |
申请公布日期 |
2011.10.25 |
申请号 |
US20090354609 |
申请日期 |
2009.01.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LEE SEONGOO;PARK RYUNGSHIK;LEE HYUNIL;JEONG HYUNSOO |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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