| 摘要 |
Heat-sealable, multi-layer composite packaging structures that are suitable for packaging and having improved sealing properties and simplified construction as compared to prior art composite film constructions are disclosed. The inventive film structure includes a first substrate, such as paper, bonded such as by extrusion lamination, to a sealable, high-barrier film. This inventive “paper-adhesive-polymer” lamination may replace prior art “paper-adhesive-foil-adhesive” foil-based tandem laminations. An improved or comparable polymer film substrate may replace the “foil-adhesive” layer components of the popular incumbent prior art structure.
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