发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
The invention is directed to providing a smaller semiconductor device formed as an optical sensor including a light receiving portion and a light emitting portion. A light receiving portion and a light emitting portion are disposed on a front surface of a semiconductor substrate for forming a semiconductor die, and a supporting body is attached to these so as to face these with an adhesive being interposed therebetween. A first opening exposing the light receiving portion from the front side of the supporting body is provided, and in a separated position therefrom, a second opening exposing the light emitting portion from the front side of the supporting body is provided. A first electrode and a second electrode are further disposed on the front surface of the semiconductor substrate, and bump electrodes electrically connected to these are disposed on the back surface of the semiconductor substrate.
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申请公布号 |
US8044440(B2) |
申请公布日期 |
2011.10.25 |
申请号 |
US20090476790 |
申请日期 |
2009.06.02 |
申请人 |
SANYO SEMICONDUCTOR CO., LTD.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
NOMA TAKASHI;SHINOGI HIROYUKI |
分类号 |
H01L27/148;G01C3/06;G01S17/32;H01H11/00;H01H35/00;H01L31/12 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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