发明名称 |
Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole |
摘要 |
In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A shielding conductive film is formed on the surfaces excluding the top surface of the body where the pattern is formed. A conductive via is extended through the body to connect one of the electrode pads with the conductive film.
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申请公布号 |
US8043896(B2) |
申请公布日期 |
2011.10.25 |
申请号 |
US20090651234 |
申请日期 |
2009.12.31 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE TAE SOO;PARK YUN HWI |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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