发明名称 Method of manufacturing a CMOS image sensor
摘要 In a method of manufacturing a complementary metal-oxide semiconductor (CMOS) image sensor (CIS), an epitaxial layer may be formed on a first substrate including a chip area and a scribe lane area. A first impurity layer may be formed adjacent to the first substrate by implanting first impurities into the epitaxial layer. A photodiode may be formed in the epitaxial layer on the chip area. A circuit element electrically connected to the photodiode may be formed on the epitaxial layer. A protective layer protecting the circuit element may be formed on the epitaxial layer. A second substrate may be attached onto the protective layer. The first substrate may be removed to expose the epitaxial layer. A color filter layer may be formed on the exposed epitaxial layer using the first impurity layer as an alignment key. A microlens may be formed over the color filter layer.
申请公布号 US8043927(B2) 申请公布日期 2011.10.25
申请号 US20090457773 申请日期 2009.06.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK BYUNG-JUN;LEE TAE-HUN;SHIN SEUNG-HUN
分类号 H01L21/76 主分类号 H01L21/76
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