| 摘要 |
A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate. |
