| 摘要 |
An active device array substrate including a substrate, an active device array, an detecting circuit, a plurality of driver chip pads, a plurality of flexible printed circuit (FPC) pads, a plurality of connection lines and an inner shorting ring is provided. The active device array and the detecting circuit are disposed on the substrate, and the detecting circuit is electrically connected to the active device array. The driver chip pads and the FPC pads are disposed on the substrate, wherein the driver chip pads are electrically connected to the active device array. The connection lines are disposed on the substrate, and each of the connection lines is respectively connected to the detecting circuit and the corresponding FPC pad. The inner shorting ring is disposed on the substrate, and the inner shorter ring is respectively electrically connected to the corresponding FPC pad and the active device array.
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