发明名称 ATOMIC LAYER GROWING APPARATUS AND THIN FILM FORMING METHOD
摘要 <p>An atomic layer growing apparatus introduces an organic metal gas containing hydrogen to a deposition vessel to cause an organic metal component to be adsorbed on a substrate. Then, the apparatus introduces an oxidizing gas or a nitriding gas to the deposition vessel to generate plasma, thereby oxidizing or nitriding the organic metal component deposited on the substrate. When the plasma is generated, the apparatus detects emission intensity of a predetermined wavelength of light emitted on the substrate through an observation window provided in the deposition vessel. When the detected emission intensity becomes a predetermined value or less, the apparatus stops the generation of the plasma.</p>
申请公布号 KR20110116043(A) 申请公布日期 2011.10.24
申请号 KR20117020860 申请日期 2010.01.28
申请人 MITSUI ENGINEERING & SHIPBUILDING CO., LTD. 发明人 TAKIZAWA KAZUKI
分类号 H01L21/205;H05H1/46 主分类号 H01L21/205
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