LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF

摘要

The present invention relates to a light-emitting diode package, comprising: a lead which provides an electrical connection from an external source, and which has a protruding portion protruding upwardly and a flat portion connected to the protruding portion; a metal housing having an accommodating portion for accommodating light-emitting chips, a heat sink portion arranged on the bottom within the accommodating portion, an insertion hole formed in the accommodating portion to allow the protruding portion of the lead to be inserted therein, and an insertion groove formed in the bottom of the metal housing to allow the flat portion of the lead to be inserted therein from the outside; and insulating members arranged to cover the protruding portion and the flat portion of the lead, and arranged at both the inner wall of the insertion hole and the inner wall of the insertion groove so as to provide insulation between the lead and the metal housing.