| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate that suppresses deformation or fracture of a soldering part where the mounting substrate and a semiconductor device are bonded together even when applied with a shock from outside in a state where the semiconductor device is mounted while suitable for high-density mounting.SOLUTION: Outside a region where the semiconductor device 121 is mounted when viewed from a thickness direction of the mounting substrate 11, reinforcing bodies 112a to 112d which enhance rigidity of the mounting substrate 111 are arranged individually adjacently to corner parts 121a to 121d of the semiconductor device 121. |
