| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which the positional deviation and lifting of an electrode caused by heating is suppressed, at module assembling, and in which the stress concentration, especially at joints between a substrate and the electrode, caused by temperature cycling is suppressed at module use, and to provide a method of manufacturing the semiconductor device.SOLUTION: The semiconductor device includes a semiconductor-mounted substrate; a housing which has an opening and houses the semiconductor-mounted substrate; and screw block terminals 31, which are secured to the periphery forming the opening and electrically connected to the semiconductor-mounted substrate. Each of the screw block terminals 31 includes a screw terminal body 35, and an electrode 32, which is held by the screw terminal body 35 and is electrically connected to the semiconductor-mounted substrate. The electrode 32 is capable of moving in a first direction of crossing a principal surface of the semiconductor-mounted substrate and held by the screw terminal body 35 so that the electrode 32 is held securely by the screw terminal body 35, when the electrode is installed to the screw terminal body 35. |
