| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus, the apparatus irradiating a substrate with a flash, that eliminates contamination of the substrate.SOLUTION: A substrate support 8 has an inclined plane 82 formed such that a part of an outer shape of a cylinder is cut obliquely from an upper end face. The inclined plane 82 is in a parallel position relation configured such that the plane is parallel with a straight line S when it is assumed that the straight line S is perpendicular to a straight line R passing the substrate support 8 from the center of the substrate W and parallel with a principal plane of the substrate W. The direction of inclination of the inclined plane 82 is inclined away from an under surface of the substrate W more toward an outer periphery of the substrate W. The substrate support 8 is mounted with the substrate W while allowing warpage of the substrate by the inclined surface 82, so dust production due to rubbing between the substrate W and substrate support 8 is avoided. |
