| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board for probe card which has low wiring resistance, in which positional shift between a probe pin provided at the ceramic wiring board for probe card and a measurement pad formed on a surface of a Si wafer is small during a heat load test, and which can be suitably used for inspection of electric characteristics, and to provide a probe card using the same.SOLUTION: In the ceramic wiring board for probe card including: a signal wiring layer having the main ingredient of at least one kind of conductive material selected from copper, tungsten, and molybdenum, as a conductive layer, between layers of ceramic insulating layers of an insulating substrate on which the plurality of ceramic insulating layers are laminated; and a ground wiring layer, the ceramic insulating layer includes a mullite-based sintered body, and the ceramic insulating layer in contact with the ground wiring layer, from among the ceramic insulating layers, includes a needle-like alumina crystal having an aspect ratio of four or more on a surface of the ceramic insulating layer. |
