MEMS DEVICE AND PRODUCTION METHOD FOR SAME

摘要

Disclosed is a MEMS device production method which enables easy manufacture of a structure wherein a substrate surface and a vibration member lower surface face each other with a sufficiently narrow gap in between. The MEMS device production method includes: a step (S1) wherein an SOI substrate is prepared; a step (S2) wherein a first silicone layer is patterned and an outer frame section, a raising and facing section, and a supporting beam section, which connects at least three positions on the raising and facing section and the outer frame section, are formed; a step (S3) wherein a state of separation between the raising and facing section and a second silicon layer is created by etching off an intermediate insulating layer positioned between the raising and facing section and the second silicone layer; a step (S4) wherein substrate is collectively pasted to the outer frame section and the raising and facing section; and a step (S5) wherein a floating structure is formed by patterning the second silicon layer and the supporting beam section is divided to isolate the raising and facing section.