| 摘要 |
PROBLEM TO BE SOLVED: To provide a first-supply type liquid semiconductor sealing resin composition which is liquid and can be cured in a short time, and suppresses a void between a semiconductor chip and a substrate for a short time, and moreover after curing, is excellent in bonding property for bonding the semiconductor chip and the substrate, and suppression of change in resistance in a THB test and separation suppression in a PCT test, in order to adapt for workability, ease in handling, and narrow in pitch.SOLUTION: The first-supply type liquid semiconductor sealing resin composition includes (A) a liquid epoxy resin, (B) an epoxy resin having a specific structure, (C) an acid anhydride curing agent, (D) an imidazole compound curing accelerator having a specific structure, and (E) a silane coupling agent, wherein the mass ratio of the (A) component and the (B) component is 84:16 to 16:84, and the acid anhydrous equivalent of the (C) component is 0.8 to 1.1 based on a total of 1 of the epoxy equivalent of the (A) component and the epoxy equivalent of the (B) component, and the (D) component is more than 1.7 pts.mass and less than 10.3 pts.mass, and the (E) component is more than 0.1 pts.mass and less than 2.3 pts.mass, based on 100 pts.mass of the total of the (A) and (B) components. |
