| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating rack and a plating device capable of suppressing fluctuations of plating thickness on the surface of a planar body to be plated by uniformizing liquid flow caused by aeration in a plating tank and suppressing rate fluctuations of liquid flow around the planar body to be plated even when collectively plating a plurality of planar bodies to be plated.SOLUTION: The plating rack 9 for storing the planar bodies to be plated includes: a retention part 4 for retaining the planar bodies to be plated from the under side; and shielding plates 5 arranged opposite to both sides on the width direction outer sides of the retention part, wherein the lower end of the shielding plate is located below the lower end of the retention part that retains the planar bodies to be plated from below. The plating device is provided with the plating rack. |
