| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for power module in which a metal layer and a heat sink are bonded without adversely affecting a junction between a ceramic substrate and the metal layer to improve reliability, and to provide a method of manufacturing the same.SOLUTION: In the substrate for power module 3 in which metal layers 6, 7 are laminated on both sides of the ceramic substrate 2 respectively, and the heat sink 5 is bonded to one metal layer 7, the metal layers 6, 7 contain crystal grains having an average particle diameter equal to or smaller than 0.5 μm, and the heat sink 5 and the metal layer 7 are directly bonded together by putting etched surfaces of both the heat sink 5 and the metal layer 7 together in a vacuum atmosphere after performing a surface cleaning etching on the surfaces of the metal layer 7 and the heat sink 5. |
