| 摘要 |
PROBLEM TO BE SOLVED: To suppress too much time required to bond members even in bonding relatively large members.SOLUTION: The bonded member manufacturing apparatus including a first gripping tool 11 that grips a first member D, a second gripping tool 12 that grips a second member E, a coating device 40 that coats a mediator G to a first joining plane Df, a moving device 20 that moves the first gripping tool 11 and/or the second gripping tool 12, and a controller, wherein the controller is disposed so as to allow the overlapping scope of the first joining plane Df and the second joining Ef to be a predetermined one or less as viewed in the thickness direction while a first enlarged plane De and a second enlarged plane Ee are opposed so as to allow them to be parallel with each other, and the first member D is moved relatively to the second member E in a direction where a scope the first joining plane Df and a second joining plane Ef overlap gradually increases as viewed in the thickness direction while keeping a distance between the first enlarged De and the second enlarged plane Ee, is provided. |
