| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-bonded semiconductor device reducing a warpage in case of a wafer junction by a simple process at low cost.SOLUTION: The manufacturing method of the wafer-bonded semiconductor device bonding a first wafer board 1 and a second wafer board 2 includes: a first step of previously forming bonding members 3 and 5 having a bonding function in case of a heating on the wafer bonding surface sides of the first wafer board 1 and the second wafer board 2; and a second step of supplying the surfaces of the bonding members formed by the first step with flux paste 4 containing at least two pulverulent-powder materials having a reactivity. The manufacturing method of the wafer-bonded semiconductor device further includes a third step of conducting an excitation for starting the reaction of the flux paste 4 supplied by the second step. |
