| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed-wiring board capable of efficiently dissipating the heat generated in a heat-generating electronic part and being easily manufactured, and to provide a method of manufacturing the flexible printed-wiring board.SOLUTION: The flexible printed-wiring board includes an insulating sheet 11, including openings 11a at positions corresponding to the mounting places of the electronic parts; second thermal conductive sheets 12A and 12B, laminated on the top face and underside of the insulating sheet 11 respectively; and circuit patterns 13 connecting the electronic parts formed on the top face of the first thermal conductive sheet 12A. The flexible printed-wiring board, further, includes first lands 14A for dissipating the heat formed, at positions corresponding to the openings 11a of the top face of the first thermal conductive sheet 12A; and the second lands 14B for dissipating the heat formed at the positions corresponding to the openings 11a of the underside of the second thermal conductive sheet 12B. The first and second thermal conductive sheets 12A and 12B are embedded in the openings 11a, and thermal conductive paths 15 are formed. |
